Stack-Based Buffer Overflow in Qualcomm's Snapdragon Products
CVE-2016-10450

9.8CRITICAL

Key Information:

Vendor
Qualcomm
Vendor
CVE Published:
18 April 2018

Summary

A potential stack-based buffer overflow vulnerability exists in the thermal service of various Qualcomm Snapdragon products prior to the security patch in April 2018. Exploitation of this weakness could allow an attacker to execute arbitrary code with elevated privileges, potentially leading to full system compromise. This vulnerability affects multiple models within the Snapdragon family, posing a significant risk to device security.

Affected Version(s)

Small Cell SoC, Snapdragon Mobile, Snapdragon Wear FSM9055, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SDX20

References

CVSS V3.1

Score:
9.8
Severity:
CRITICAL
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Network
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

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