Overflow Vulnerability in Snapdragon Products by Qualcomm
CVE-2017-18124
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 26 October 2018
Summary
A buffer overflow vulnerability has been identified in several Snapdragon products by Qualcomm, particularly affecting the secure boot process. This issue arises due to an addition operation performed on uint8 pointers, resulting in an overflow that may compromise the device's security integrity. The affected series includes various FSM, IPQ, and MDM models, as well as multiple SD variants. Users and developers should assess their systems for impact and apply necessary updates as recommended by the vendor.
Affected Version(s)
Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved