Overflow Vulnerability in Snapdragon Products by Qualcomm
CVE-2017-18124

7.8HIGH

Key Information:

Vendor
Qualcomm
Status
Small Cell Soc, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
26 October 2018

Summary

A buffer overflow vulnerability has been identified in several Snapdragon products by Qualcomm, particularly affecting the secure boot process. This issue arises due to an addition operation performed on uint8 pointers, resulting in an overflow that may compromise the device's security integrity. The affected series includes various FSM, IPQ, and MDM models, as well as multiple SD variants. Users and developers should assess their systems for impact and apply necessary updates as recommended by the vendor.

Affected Version(s)

Small Cell SoC, Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear FSM9055, IPQ4019, MDM9206, MDM9607, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDX20

References

https://www.qualcomm.com/company/product-security/bulletins
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CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.