Use After Free Vulnerability in Snapdragon Products by Qualcomm
CVE-2017-18157

7.8HIGH

Key Information:

Vendor

Qualcomm Technologies, Inc.

Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
6 May 2019

What is CVE-2017-18157?

A Use After Free condition exists in the Thermal Engine of various Snapdragon platforms, which can lead to potential memory corruption and may allow an attacker to execute arbitrary code. This vulnerability affects multiple Snapdragon product lines, including automotive, mobile, and wearable technologies. Users of affected Snapdragon devices should ensure their systems are updated to mitigate the risks associated with this vulnerability.

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Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9607

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9650

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

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