Integer Underflow Vulnerability in Snapdragon Mobile Platforms by Qualcomm
CVE-2017-18173

7.8HIGH

Key Information:

Vendor

Qualcomm Technologies, Inc.

Status
Snapdragon Mobile
Vendor
CVE Published:
6 May 2019

What is CVE-2017-18173?

A critical integer underflow vulnerability exists in the Qualcomm Snapdragon mobile platforms when handling an invalid Android verified boot signature of excessively large length. This flaw affects a range of Snapdragon processors, including SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016. Exploitation of this vulnerability could lead to significant security risks, including unauthorized access or manipulation of system functionality.

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Affected Version(s)

Snapdragon Mobile SD 425

Snapdragon Mobile SD 427

Snapdragon Mobile SD 430

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_MISC

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

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