Integer Underflow Vulnerability in Snapdragon Mobile Platforms by Qualcomm
CVE-2017-18173

7.8HIGH

Key Information:

Vendor
Qualcomm Technologies, Inc.
Status
Snapdragon Mobile
Vendor
CVE Published:
6 May 2019

Summary

A critical integer underflow vulnerability exists in the Qualcomm Snapdragon mobile platforms when handling an invalid Android verified boot signature of excessively large length. This flaw affects a range of Snapdragon processors, including SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016. Exploitation of this vulnerability could lead to significant security risks, including unauthorized access or manipulation of system functionality.

Affected Version(s)

Snapdragon Mobile SD 425

Snapdragon Mobile SD 427

Snapdragon Mobile SD 430

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_MISC

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.