Integer Underflow Vulnerability in Snapdragon Mobile Platforms by Qualcomm

CVE-2017-18173

What is CVE-2017-18173?

A critical integer underflow vulnerability exists in the Qualcomm Snapdragon mobile platforms when handling an invalid Android verified boot signature of excessively large length. This flaw affects a range of Snapdragon processors, including SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016. Exploitation of this vulnerability could lead to significant security risks, including unauthorized access or manipulation of system functionality.

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