Buffer Overflow Vulnerability in Qualcomm's Snapdragon Products
CVE-2017-18274

7.8HIGH

Key Information:

Vendor
Qualcomm Technologies, Inc.
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
6 May 2019

Summary

A vulnerability exists in Qualcomm's Snapdragon hardware where an incorrect size parameter leads to a buffer overflow during model iteration in the actData structure. This flaw affects various Snapdragon products, compromising device stability and security. Proper validation and management of the model count are critical to preventing potential exploits that could arise from this issue.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9607

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9650

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_MISC

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.