Buffer Overflow Vulnerability in Snapdragon Camera Modules by Qualcomm
CVE-2017-18279
Key Information:
- Vendor
- Qualcomm Technologies, Inc.
- Status
- Small Cell Soc, Snapdragon Mobile, Snapdragon Wear
- Vendor
- CVE Published:
- 6 May 2019
Summary
A buffer overflow vulnerability exists in the camera module of several Qualcomm Snapdragon products. This issue arises from insufficient checks on buffer lengths prior to copying, allowing potential attackers to exploit this weakness. If successfully exploited, it could lead to undesirable outcomes in devices utilizing affected Snapdragon SoCs, affecting system stability and security. It is crucial for users to ensure their devices are updated to mitigate related risks. More information can be found on Qualcomm's official security bulletins page.
Affected Version(s)
Small Cell SoC, Snapdragon Mobile, Snapdragon Wear FSM9055
Small Cell SoC, Snapdragon Mobile, Snapdragon Wear FSM9955
Small Cell SoC, Snapdragon Mobile, Snapdragon Wear IPQ4019
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved