Buffer Overflow Vulnerability in Snapdragon Camera Modules by Qualcomm
CVE-2017-18279

7.8HIGH

Key Information:

Vendor
Qualcomm Technologies, Inc.
Status
Small Cell Soc, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
6 May 2019

Summary

A buffer overflow vulnerability exists in the camera module of several Qualcomm Snapdragon products. This issue arises from insufficient checks on buffer lengths prior to copying, allowing potential attackers to exploit this weakness. If successfully exploited, it could lead to undesirable outcomes in devices utilizing affected Snapdragon SoCs, affecting system stability and security. It is crucial for users to ensure their devices are updated to mitigate related risks. More information can be found on Qualcomm's official security bulletins page.

Affected Version(s)

Small Cell SoC, Snapdragon Mobile, Snapdragon Wear FSM9055

Small Cell SoC, Snapdragon Mobile, Snapdragon Wear FSM9955

Small Cell SoC, Snapdragon Mobile, Snapdragon Wear IPQ4019

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_MISC

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.