Cryptographic Key Material Leak in Qualcomm Snapdragon Products
CVE-2017-18323
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 3 January 2019
Summary
A cryptographic key material leak has been identified in Qualcomm's Snapdragon products, specifically within TDSCDMA RRC debug messages. This leak can potentially expose sensitive key information used within various Snapdragon versions, including mobile, automobile, and wearable devices. The leaked material can lead to unauthorized access and compromise the security of the affected systems. Users of Qualcomm Snapdragon technology should take immediate steps to assess their exposure and apply any available security updates to mitigate this vulnerability.
Affected Version(s)
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved