Cryptographic Key Material Leak in Qualcomm Snapdragon Products
CVE-2017-18323

5.5MEDIUM

Key Information:

Vendor
Qualcomm
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
3 January 2019

Summary

A cryptographic key material leak has been identified in Qualcomm's Snapdragon products, specifically within TDSCDMA RRC debug messages. This leak can potentially expose sensitive key information used within various Snapdragon versions, including mobile, automobile, and wearable devices. The leaked material can lead to unauthorized access and compromise the security of the affected systems. Users of Qualcomm Snapdragon technology should take immediate steps to assess their exposure and apply any available security updates to mitigate this vulnerability.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
http://www.securityfocus.com/bid/106128
vdb-entryx_refsource_BID

CVSS V3.1

Score:
5.5
Severity:
MEDIUM
Confidentiality:
High
Integrity:
None
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.