Buffer Overflow in AES Encryption in Qualcomm Snapdragon Products
CVE-2017-18330

7.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
3 January 2019

Summary

A vulnerability exists in Qualcomm's Snapdragon products due to a buffer overflow in the AES-CCM and AES-GCM encryption processes. This issue arises from improper handling of the initialization vector, affecting a wide range of Snapdragon chipsets. Exploitation of this vulnerability could compromise cryptographic protocols, leading to potential unauthorized data access or other malicious activities in devices relying on these processors.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
http://www.securityfocus.com/bid/106128
vdb-entryx_refsource_BID

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.