CVE-2018-11264

7.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
28 November 2018

Summary

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
http://www.securityfocus.com/bid/105838
vdb-entryx_refsource_BID

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.