Buffer Overflow Vulnerability in Qualcomm Snapdragon Products
CVE-2018-11264
Key Information:
- Vendor
Qualcomm
- Vendor
- CVE Published:
- 28 November 2018
What is CVE-2018-11264?
A buffer overflow vulnerability exists in the Ontario fingerprint processing code due to inadequate input validation for parameters transmitted from the HLOS to the TZ in various Qualcomm Snapdragon products. This oversight allows an attacker to exploit the vulnerability, possibly leading to code execution or system compromise. The affected devices span several Snapdragon models, raising security concerns for users relying on these platforms.

Human OS v1.0:
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Affected Version(s)
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved