Buffer Overflow Vulnerability in Qualcomm Snapdragon Products
CVE-2018-11264
7.8HIGH
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 28 November 2018
Summary
A buffer overflow vulnerability exists in the Ontario fingerprint processing code due to inadequate input validation for parameters transmitted from the HLOS to the TZ in various Qualcomm Snapdragon products. This oversight allows an attacker to exploit the vulnerability, possibly leading to code execution or system compromise. The affected devices span several Snapdragon models, raising security concerns for users relying on these platforms.
Affected Version(s)
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660
References
CVSS V3.1
Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged
Timeline
Vulnerability published
Vulnerability Reserved