Buffer Overflow Vulnerability in Qualcomm Snapdragon Products
CVE-2018-11279

8.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
18 January 2019

Summary

A buffer overflow vulnerability exists in various Qualcomm Snapdragon products. This flaw arises from a failure to properly validate input sizes, leading to potential memory corruption. Devices using affected Snapdragon models may be at risk of crashing or being exploited, thereby allowing unauthorized access to sensitive data. It is crucial for users and developers to be aware of these vulnerabilities and ensure their systems are updated to mitigate potential threats.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM
http://www.securityfocus.com/bid/106128
vdb-entryx_refsource_BID

CVSS V3.1

Score:
8.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Adjacent Network
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.