Buffer Overflow Vulnerability in WideVine Affects Qualcomm Snapdragon Products
CVE-2018-5867

7.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
18 January 2019

Summary

The vulnerability stems from a lack of proper input size checks in WideVine components across multiple Qualcomm Snapdragon platforms. This oversight can potentially lead to buffer overflow attacks, allowing unauthorized access or execution of malicious code in devices running affected Snapdragon versions. Organizations utilizing these products should prioritize updating their systems to mitigate the associated risks.

Affected Version(s)

Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130

References

https://www.qualcomm.com/company/product-security/bulletins
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http://www.securityfocus.com/bid/106128
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CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.