Buffer Overflow Vulnerability in WideVine Affects Qualcomm Snapdragon Products
CVE-2018-5867
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 18 January 2019
Summary
The vulnerability stems from a lack of proper input size checks in WideVine components across multiple Qualcomm Snapdragon platforms. This oversight can potentially lead to buffer overflow attacks, allowing unauthorized access or execution of malicious code in devices running affected Snapdragon versions. Organizations utilizing these products should prioritize updating their systems to mitigate the associated risks.
Affected Version(s)
Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved