Heap Overflow Vulnerability in Snapdragon Mobile and Wear Products by Qualcomm
CVE-2018-5879

8.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
18 January 2019

Summary

An improper length check when processing MQTT messages in Qualcomm's Snapdragon Mobile and Wear products can lead to a heap overflow condition. This issue affects multiple versions, including MDM9206, MDM9607, and several Snapdragon chipsets, potentially allowing attackers to execute arbitrary code or manipulate system resources. Users are advised to update their devices to the latest firmware versions to mitigate any associated risks.

Affected Version(s)

Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM

CVSS V3.1

Score:
8.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Adjacent Network
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.