Buffer Overflow Vulnerability in Snapdragon Mobile and Wear Products by Qualcomm
CVE-2018-5880

7.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
18 January 2019

Summary

A vulnerability exists due to improper data length checks while processing an event report indication, which may result in a buffer overflow. This issue affects various Qualcomm Snapdragon mobile and wear products. Attackers can exploit this vulnerability by sending specially crafted data, potentially leading to arbitrary code execution and the compromise of the impacted device’s integrity and availability. Ensuring that devices are updated to the latest firmware is critical to mitigating the risk associated with this vulnerability.

Affected Version(s)

Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.