Buffer Overflow in Snapdragon Mobile and Wear Devices by Qualcomm
CVE-2018-5881

8.8HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Mobile, Snapdragon Wear
Vendor
CVE Published:
18 January 2019

Summary

The vulnerability involves improper validation of buffer length checks within the lwm2m device management protocol, leading to potential buffer overflow issues in various Qualcomm Snapdragon mobile and wearable devices. This oversight can expose devices to security risks, enabling attackers to manipulate memory contents and potentially execute arbitrary code. Users are advised to apply security updates provided by Qualcomm to safeguard their devices.

Affected Version(s)

Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660

References

https://www.qualcomm.com/company/product-security/bulletins
x_refsource_CONFIRM

CVSS V3.1

Score:
8.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Adjacent Network
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.