Image Verification Bypass in Qualcomm Snapdragon Products
CVE-2021-30317
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 11 February 2022
Summary
This vulnerability arises from improper validation of program headers that contain ELF metadata across various Qualcomm Snapdragon products. Attackers may exploit this flaw to bypass image verification, potentially leading to unauthorized access or execution of malicious code. It is crucial for users of affected Snapdragon platforms to apply necessary patches and updates to mitigate risks associated with this vulnerability.
Affected Version(s)
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking AQT1000, AR8031, AR8035, CSRA6620, CSRA6640, CSRB31024, MDM9150, MDM9250, MDM9650, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8337, QCA9377, QCA9984, QCM2290, QCM4290, QCM6125, QCM6490, QCN7605, QCN7606, QCS2290, QCS405, QCS410, QCS4290, QCS603, QCS605, QCS610, QCS6125, QCS6490, QCX315, SA415M, SA515M, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD 675, SD 8cx Gen2, SD460, SD480, SD660, SD662, SD665, SD675, SD678, SD690 5G, SD720G, SD730, SD750G, SD765, SD765G, SD768G, SD778G, SD7c, SD845, SD850, SD855, SD865 5G, SD870, SD888, SD888 5G, SDX12, SDX24, SDX55, SDX55M, SDXR1, SDXR2 5G, SM6225, SM6250, SM6250P, SM6375, SM7250P, SM7315, SM7325P, WCD9326, WCD9335, WCD9340, WCD9341, WCD9360, WCD9370, WCD9375, WCD9380, WCD9385, WCN3910, WCN3950, WCN3980, WCN3988, WCN3990, WCN3991, WCN3998, WCN3999, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8810, WSA8815, WSA8830, WSA8835
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved