Buffer Overflow Vulnerability in Qualcomm Snapdragon Products
CVE-2022-25724

8.4HIGH

Key Information:

Vendor
Qualcomm
Status
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Iot, Snapdragon Industrial Iot, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Vendor
CVE Published:
15 November 2022

Summary

This vulnerability pertains to a memory corruption issue caused by a buffer overflow during the validation of user addresses in various Qualcomm Snapdragon products. The flaw spans multiple product categories, including automotive, computing, connectivity, consumer IoT, industrial IoT, mobile, audio, and wearable devices. Exploiting this vulnerability could potentially allow an attacker to execute arbitrary code, compromising the integrity and security of the affected systems. It's imperative for users and administrators to be vigilant and apply any available patches or updates to mitigate risks associated with this vulnerability.

Affected Version(s)

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009W

Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8017

References

https://www.qualcomm.com/company/product-security/bulleti...

CVSS V3.1

Score:
8.4
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

.