Buffer Overflow Vulnerability in Qualcomm Snapdragon Products
CVE-2022-25724
Key Information:
- Vendor
- Qualcomm
- Vendor
- CVE Published:
- 15 November 2022
Summary
This vulnerability pertains to a memory corruption issue caused by a buffer overflow during the validation of user addresses in various Qualcomm Snapdragon products. The flaw spans multiple product categories, including automotive, computing, connectivity, consumer IoT, industrial IoT, mobile, audio, and wearable devices. Exploiting this vulnerability could potentially allow an attacker to execute arbitrary code, compromising the integrity and security of the affected systems. It's imperative for users and administrators to be vigilant and apply any available patches or updates to mitigate risks associated with this vulnerability.
Affected Version(s)
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009W
Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8017
References
CVSS V3.1
Timeline
Vulnerability published
Vulnerability Reserved