Intra-Object Overflow in Samsung Mobile and Baseband Modem Chipsets

CVE-2023-26075

Summary

A notable vulnerability has been identified in Samsung's Mobile Chipset and Baseband Modem Chipset that affects several models, including Exynos 850 and Exynos 980, among others. This vulnerability can lead to an intra-object overflow due to inadequate parameter validation during the decoding process of the Service Area List within the 5G MM message codec. Such overflow issues can potentially allow attackers to exploit affected systems, creating security risks. Users and organizations utilizing these chipsets should remain vigilant and apply any offered security updates.

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