Transient DOS Vulnerability in Wi-Fi Chip Affects Device Performance.

CVE-2024-23364
7.5HIGH

Key Information

Vendor
Qualcomm
Status
Snapdragon
Vendor
CVE Published:
2 September 2024

Summary

Transient DOS when processing the non-transmitted BSSID profile sub-elements present within the MBSSID Information Element (IE) of a beacon frame that is received from over-the-air (OTA).

Affected Version(s)

Snapdragon = AR8035

Snapdragon = FastConnect 6200

Snapdragon = FastConnect 6700

CVSS V3.1

Score:
7.5
Severity:
HIGH
Confidentiality:
None
Integrity:
None
Availability:
High
Attack Vector:
Network
Attack Complexity:
Low
Privileges Required:
None
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published.

  • Vulnerability Reserved.

Collectors

NVD DatabaseMitre Database
.