Memory Corruption Vulnerability in Qualcomm Trusted Execution Environment
CVE-2025-47385

7.8HIGH

Key Information:

Vendor

Qualcomm
Status
Snapdragon
Vendor
CVE Published:
2 March 2026

What is CVE-2025-47385?

A memory corruption vulnerability has been identified in the Qualcomm Trusted Execution Environment (TEE). This flaw arises when memory is accessed without adequate privilege checks, potentially allowing unauthorized access to sensitive operations within the TEE. This vulnerability can compromise system security and data integrity, making it essential for users and administrators to take precautionary measures and stay informed about applicable security updates.

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Affected Version(s)

Snapdragon Snapdragon Auto FastConnect 6200

Snapdragon Snapdragon Auto FastConnect 6700

Snapdragon Snapdragon Auto FastConnect 6900

References

https://docs.qualcomm.com/product/publicresources/securit...

CVSS V3.1

Score:
7.8
Severity:
HIGH
Confidentiality:
High
Integrity:
High
Availability:
High
Attack Vector:
Local
Attack Complexity:
Low
Privileges Required:
Low
User Interaction:
None
Scope:
Unchanged

Timeline

  • Vulnerability published

  • Vulnerability Reserved

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